Doug Cheng, OneChip Photonics Inc.产品总监

演讲人简历：Doug 有20多年电信产品线工程管理经验.之前 Doug也是直担任飞博创（Fiberxon Inc）产品线总监 , 他也曾在 Nokia, Nortel, and Lantern Communications 担任过类似的职位。
 

演讲题目：“Photonic Integration in New-Generation FTTH Networks”下一代FTTH网络中的光子集成

摘        要：分析为什么光子集成是FTTH的关键技术，此技术仍未被成功实施的原因、以及在成本和性能上产生突破的新兴光子集成技术。

学习目标：系统商和运营商将了解如何比以往更经济有效地部署FTTH网络，来满足语音、数据和视频等三重播放服务的需求。

演讲概述：早在光子技术这个词和概念被详细定义以前，光子技术就在宽带革命的热潮中起到举足轻重的作用。半导体激光器和检测器、低损耗光纤，以及后来的光放大器的发明使得长距离传输成为现实。

　　今天，电信运营商在满足消费者和企业对语音、数据和视频等高宽带需求的同时，也面临着服务差异化的压力，只有这样才能从竞争者中脱颖而出，这使得把光子技术应用于FTTH网络比以往显得更加迫切和必要。
 
　　为了提升光系统性能，很早之前业界就梦想将各种光器件集成到光子集成电路（PIC）中，然而直到最近这种技术才在长距离光传输系统中得到大规模应用。
　　不过，当人们想把这种技术应用到那些对成本较敏感、需要大批量制造的产品领域时，比如FTTH网络中的EPON 和 GPON 收发器，却面临着缺乏一种兼具成本效益光子集成技术的尴尬。

　　因此，那些PON 收发器厂商依然选择使用传统的光学装配技术。而平面光波导（PLC）技术则帮助光学装配技术朝着迈入“印制电路板时代”迈出了第一步。
 
　　最近，一种新的工艺应运而生：使用低成本的器件设计和工艺，把单片集成光子器件整合到单个半导体管芯上——这意味着它将把宽带革命推向了“集成电路时代”。这种工艺甚至可以适用于对价格异常敏感的应用领域中，比如FTTH。

Speaker:

Doug Cheng, Director of Product Line Management

OneChip Photonics Inc.

Speaker bio:  Doug has more than 20 years of Engineering and Product Line Management experience in the Telecommunications industry. Most recently, he was the Director of Product Line Management at Fiberxon Inc. Prior to that, Doug held similar positions at Nokia, Nortel, and Lantern Communications in Europe and Canada
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Presentation title:  Photonic Integration in New-Generation FTTH Networks
Abstract:  This paper and presentation will examine why photonic integration will be a key enabler for FTTH, why such technology has not been successfully implemented so far, and what new methods of photonic integration will create breakthroughs in cost and performance.

Learning objectives:  System providers and carriers will learn how they can deploy FTTH more cost-effectively than ever before and meet demand for “triple-play” voice, data and video services.

Presentation summary:  Photonics technology has played a pivotal role in fostering and enabling the Broadband Revolution even before the term and the concept were articulated. The invention of semiconductor lasers and detectors, low-loss optical fiber and, later, optical amplifiers, made long-distance data transport feasible.

Now, as telecom operators look to meet consumer and business demand for high-bandwidth voice, data and video services – and differentiate themselves from competitors – there is more of an imperative than ever before to extend photonics technology into FTTH networks.

Because of this imperative to extend the frontiers of optical system performance, integration of photonic devices into Photonic Integrated Circuits (PICs) has long been foreseen, but only recently commercially realized in long-reach optical transport systems.

However, the application of photonics integration into cost-sensitive, high-volume applications such as EPON and GPON transceivers for FTTH systems has been impaired by the lack of a cost-effective photonic integration technology.

Manufacturers of PON transceivers have, therefore, employed conventional optical assembly techniques. Planar Lightwave Circuits (PLCs) have taken an initial step into bringing optical assemblies into the "printed circuit board era."

Recently, a new approach to monolithically integrating photonic devices onto single semiconductor die – using  low-cost device designs and processing – is promising to propel the Broadband Revolution into the "integrated circuit era" even for very cost-sensitive applications such as FTTH.